SEMICONDUCTOR REFERENCE

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Find products, devices, processes and manufacturing tools with specifications and original sources.

Specification query syntax

Use cores, threads, clock, boost, l2, l3, tdp, memory or year with =, >=, <=, > or <. Units: GHz, MB, W, GB. Unknown or conflicting values do not match numeric conditions.

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cpu

Source values retain units and entity scope. Open the citation on the record for conditions. Missing fields are unresearched; conflicting observations remain visible.
Entity	CPU organization	Clock / peak	Cache	Process label	Die area
Ryzen 3 PRO 2200GEAMD · product model · 2018	4Cores	3200 MHzBase clock	2 MiBL2 cache	14 nmProcess	209.78 mm²Die area
Ryzen 3 2200GEAMD · product model · 2018	4Cores	3200 MHzBase clock	2 MiBL2 cache	14 nmProcess	209.78 mm²Die area
Ryzen 3 PRO 2200GAMD · product model · 2018	4Cores	3500 MHzBase clock	2 MiBL2 cache	14 nmProcess	209.78 mm²Die area
Ryzen 5 PRO 2400GEAMD · product model · 2018	4Cores	3200 MHzBase clock	2 MiBL2 cache	14 nmProcess	209.78 mm²Die area
Ryzen 5 2600EAMD · product model · 2018	6Cores	3100 MHzBase clock	3 MiBL2 cache	12 nmProcess	213 mm²Die area
Ryzen 5 PRO 2400GAMD · product model · 2018	4Cores	3600 MHzBase clock	2 MiBL2 cache	14 nmProcess	209.78 mm²Die area
Ryzen 5 PRO 2600AMD · product model · 2018	6Cores	3400 MHzBase clock	3 MiBL2 cache	12 nmProcess	213 mm²Die area
Ryzen 5 2400GEAMD · product model · 2018	4Cores	3200 MHzBase clock	2 MiBL2 cache	14 nmProcess	209.78 mm²Die area
Ryzen 7 2700AMD · product model · 2018	8Cores	3200 MHzBase clock	4 MiBL2 cache	12 nmProcess	213 mm²Die area
Ryzen 7 2700X Gold EditionAMD · product model · 2019	8Cores	3700 MHzBase clock	4 MiBL2 cache	12 nmProcess	213 mm²Die area
Ryzen 7 2700EAMD · product model · 2018	8Cores	2800 MHzBase clock	4 MiBL2 cache	12 nmProcess	213 mm²Die area
Ryzen 7 PRO 2700XAMD · product model · 2018	8Cores	3600 MHzBase clock	4 MiBL2 cache	12 nmProcess	213 mm²Die area

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cpu