VLSI KoreaSEMICONDUCTOR REFERENCE
반도체 컬렉션 탐색
제품·소자·공정·제조 장비의 사양과 원문 출처를 찾아보세요.
사양 조건 검색 문법
cores·threads·clock·boost·l2·l3·tdp·memory·year에 =, >=, <=, >, < 조건을 사용합니다. 기본 단위: GHz, MB, W, GB. 미확인·상충 값은 수치 조건에 포함하지 않습니다.
검색 결과
cpu
| Compare | Entity | CPU organization | Clock / peak | Cache | Process label | Die area |
|---|---|---|---|---|---|---|
AMD Zen 2 CCDAMD · silicon die · 2019 | 2 CCXsCCXs per CCDphysical core-complex die | unresearched | 16 MBMaximum L3 per CCXphysical core-complex die | unresearched | 74 mm²Die areaOne Zen 2 7nm CPU Core Complex Die (CCD), design-level disclosure | |
Intel 4004Intel · silicon die · 1971 | unresearched | unresearched | unresearched | 10 µmProcess labelprocessor design | unresearched | |
Intel 8086Intel · silicon die · 1978 | unresearched | unresearched | unresearched | 3 µmProcess labelprocessor design | unresearched | |
MOS Technology 6502MOS Technology · silicon die · 1975 | unresearched | unresearched | unresearched | unresearched | unresearched | |
Intel386 DXIntel · product family · 1985 | unresearched | unresearched | unresearched | unresearched | unresearched | |
Intel Pentium 60/66 MHzIntel · silicon die · 1993 | unresearched | unresearched | unresearched | 0.8 µmProcess labeloriginal 60/66 MHz models | unresearched | |
AMD Ryzen 5 3600AMD · product model · 2019 | unresearched | unresearched | 32 MBL3 cachecomplete processor product | unresearched | unresearched | |
AMD Ryzen 5 5600XAMD · product model · 2020 | unresearched | unresearched | 32 MBL3 cachecomplete processor product | unresearched | unresearched |
gpu
| Compare | Entity | Compute organization | Local memory | External memory | Memory bandwidth | Die area |
|---|---|---|---|---|---|---|
NVIDIA GeForce 256NVIDIA · silicon die · 1999 | unresearched | unresearched | unresearched | unresearched | unresearched | |
NVIDIA GH100 full GPU designNVIDIA · silicon die · 2022 | unresearched | unresearched | unresearched | unresearched | 814 mm²Die areaOne full GH100 silicon die powering H100 |
specimen
| Compare | Entity | Subject | Package | Die area |
|---|---|---|---|---|
AMD Zen 3 CCD specimenAMD · physical specimen | unresearched | unresearched | unresearched |
accelerator
| Compare | Entity | Compute organization | Local memory | External memory | Memory bandwidth | Die area |
|---|---|---|---|---|---|---|
NVIDIA A100NVIDIA · silicon die · 2020 | unresearched | unresearched | unresearched | unresearched | 826 mm²Die areaOne GA100 silicon die powering A100 |
사양 비교
출처의 값·조건·대상 범위를 함께 비교합니다.
| Specification / evidence | Samsung Exynos 2100silicon-die | Samsung Exynos 9820silicon-die |
|---|---|---|
| Record year | official-disclosure · sourcedScope: SoC designSource date: 2021-01-12Year basis: announced. This is distinct from source publication and record update.Source ↗ | Unresearched for this record |
| Process label | official-disclosure · sourcedScope: SoC designSource date: 2021-01-12Source ↗ | Unresearched for this record |
| CPU cores | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| CPU composition | official-disclosure · sourcedScope: SoC designSource date: 2021-01-12Source ↗ | Unresearched for this record |
| Cortex-X1 clock | official-disclosure · sourcedScope: SoC designSource date: 2021-01-12Source ↗ | Unresearched for this record |
| Announcement date | official-disclosure · sourcedScope: SoC designSamsung announced it through Exynos On 2021.Source ↗ | Unresearched for this record |
| Process | official-disclosure · sourcedScope: SoC designSource ↗ | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| CPU topology | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| CPU prime core | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| CPU prime peak | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| CPU performance cores | official-disclosure · sourcedScope: SoC designSource ↗ | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| CPU efficiency cores | official-disclosure · sourcedScope: SoC designSource ↗ | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| GPU | official-disclosure · sourcedScope: SoC designSource ↗ | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| Graphics apis | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| NPU architecture | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| NPU advertised performance | official-disclosure · sourcedScope: SoC designManufacturer-reported performance; workload, precision and test conditions affect comparisons.Source ↗ | Unresearched for this record |
| Memory | official-disclosure · sourcedScope: SoC designSource ↗ | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| Memory bandwidth | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| Storage | official-disclosure · sourcedScope: SoC designSource ↗ | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| Maximum camera resolution | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| Camera sensor concurrency | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| Video encoding | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| Video decoding | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| Modem | official-disclosure · sourcedScope: SoC designSource ↗ | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| Modem peak downlink | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| Production status | official-disclosure · sourcedScope: SoC designSource ↗ | Unresearched for this record |
| Reported die area | third-party-report · sourcedScope: SoC designKurnal’s original die-shot entry reports 10.93 × 11.72 mm and 128.1 mm². Samsung does not publish die area.Source ↗ | Unresearched for this record |
| CPU custom | Unresearched for this record | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| AI | Unresearched for this record | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| Camera | Unresearched for this record | official-disclosure · sourcedScope: silicon-dieSource ↗ |
| Video | Unresearched for this record | official-disclosure · sourcedScope: silicon-dieSource ↗ |
실측 벤치마크는 워크로드·버전·구성·전력 모드·날짜가 필요합니다. 이론 최고치와 제조사 주장은 실측 결과가 아닙니다.