VLSI Korea
Workload and traffic model
Build a traffic matrix across the documented CPU, graphics, AI and I/O engines. Model concurrent bursts, locality and worst-case response time at shared memory before choosing arbitration or buffering.
APPLE / SILICON DESIGN
Apple A18
Second-generation 3 nm iPhone SoC with a six-core CPU and five-core GPU.
Apple A18 DIE PHOTOGRAPH
Image courtesy of Chipwise ·Used with permission· Die photograph · Resized and format-converted for display; original image content and watermarks preserved.
Origin & contributions
Original source · Retrieved 2026-09-09
Chipwise / NanoPhysics · photographer · Included in this image
Image courtesy of Chipwise · Used with permission. Link the original Chipwise source page and retain its markings and credits. Permission reported by the Museum operator on 2026-09-09. Display resizing and format conversion only; no removal of annotations or watermarks. No onward redistribution or comparison-export licence is granted by the Museum.
Apple A18 & A18 pro die shot. See source caption; no chip layer inferred beyond source evidence
Source photography; preparation and visible markings are preserved. This photograph supplies no independently verified geometric measurements.
Specifications
12 SOURCE-LINKED FIELDS| Identity & fabrication | |
|---|---|
| Year | Manufacturer / primary sourceApple Scope: silicon-die Source date: 2024-09-09 Year identifies first public introduction where a dated launch is available; see record notes for exceptions. |
| Process | Manufacturer / primary sourceApple Scope: silicon-die |
| Foundry | Published analysisKurnal Insights Scope: silicon-die Source date: 2026-05-05 Independent analyst attribution. |
| CPU & clock domains | |
| CPU | Manufacturer / primary sourceApple Scope: silicon-die |
| Graphics | |
| GPU | Manufacturer / primary sourceApple Scope: silicon-die |
| Ray tracing | Manufacturer / primary sourceApple Scope: silicon-die |
| AI & security | |
| Neural Engine cores | Manufacturer / primary sourceApple Scope: silicon-die Source date: 2024-09-09 |
| Neural Engine | Manufacturer / primary sourceApple Scope: silicon-die |
| Packaging, power & physical analysis | |
| Reported die width | Published analysisKurnal Insights Scope: silicon-die Source date: 2026-05-05 Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty. |
| Reported die height | Published analysisKurnal Insights Scope: silicon-die Source date: 2026-05-05 Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty. |
| Reported die area | Published analysisKurnal Insights Scope: silicon-die Source date: 2026-05-05 Original analyst catalog value. Public entry gives dimensions but does not document calibration, die boundary convention, specimen provenance or uncertainty. |
| Verified die geometry | UnconfirmedApple Scope: silicon-die Source date: 2024-09-09 No source meeting calibrated geometry requirements accepted in this scout pass. Reported measurements, if present, remain separately labeled. |
Source-linked recordEditorial update
ARCHITECTURE → RTL → GDS
All design guides ↗Design with this record
Start with documented specifications, then use the study prompts below. The prompts are engineering guidance, not a claim about this product’s private RTL or physical implementation.
- GPU
- Apple ↗
- Process
- Apple ↗
- Reported die area
- Kurnal Insights ↗
Contracts before RTL
Choose a representative producer/consumer path and specify acceptance, ordering, backpressure, outstanding capacity and reset recovery. Turn these contracts into assertions and test scenarios before optimizing the datapath.
A feasible physical plan
Obtain macro abstracts, pin maps, timing libraries and activity-based power estimates. Explore macro proximity, routing channels and power-grid reachability together. An annotated die photograph can suggest study questions, but cannot supply a netlist, PDK or signoff constraints.
Read the record in its physical scope.
Second-generation 3 nm iPhone SoC with a six-core CPU and five-core GPU.
This record has identification and source evidence. A deeper architectural article has not yet been written. Visible patterns alone do not establish block functions, capacity or an internal protocol.
Follow the connections
2 SOURCE-LINKED RELATIONSHIPSProduct-series membership; does not assert shared masks or identical silicon.
Apple · EvidenceComparison image contains multiple dies; it is not a photograph of one die or a geometric measurement.
Chipwise / NanoPhysics · EvidenceTHE VISUAL EVIDENCE
2 DOCUMENTED SOURCESVisual sources
Hosted image provenance · 2
Die photographHosted in Museum
Apple A18 — Die photograph
Chipwise / NanoPhysics
600 × 399 pxTechnical archive / analysis
Apple A18 & A18 pro die shot. Frontside die view, as identified by source
View original die photoRights, provenance & link history
- Rights status
- PERMISSION GRANTED
- Local hosting / thumbnails / hotlinking
- Allowed / Allowed / Not enabled
- Attribution
- Image courtesy of Chipwise · Used with permission
- Identity / confidence
- matched / high
- Evidence reviewed
- 2026-09-09
- Link checked
- 2026-09-09 · ok · HTTP 200
Access to a source does not grant permission to reproduce its images.
Die photographHosted in Museum
Apple A18 — Die photograph
Chipwise / NanoPhysics
600 × 400 pxTechnical archive / analysis
Apple A18 & A18 pro die shot. See source caption; no chip layer inferred beyond source evidence
View original die photoRights, provenance & link history
- Rights status
- PERMISSION GRANTED
- Local hosting / thumbnails / hotlinking
- Allowed / Allowed / Not enabled
- Attribution
- Image courtesy of Chipwise · Used with permission
- Identity / confidence
- matched / high
- Evidence reviewed
- 2026-09-09
- Link checked
- 2026-09-09 · ok · HTTP 200
Access to a source does not grant permission to reproduce its images.
Source trail
Apple introduces iPhone 16 and iPhone 16 Plus ↗ · Apple
Kurnal die catalog: Apple A18 ↗ · Kurnal Insights
Apple introduces iPhone 16 and iPhone 16 Plus ↗ · Apple
Apple A18 & A18 pro die shot — Chipwise image source ↗ · Chipwise / NanoPhysics