SOURCE-LINKED COMPARISON
Samsung Exynos 2100 vs Samsung Exynos 2200
CPU description: Samsung Exynos 2100 1 Cortex-X1 + 3 Cortex-A78 + 4 Cortex-A55; Samsung Exynos 2200 1 Cortex-X2 + 3 Cortex-A710 + 4 Cortex-A510. A sourced specification comparison.
Samsung Exynos 2100 and Samsung Exynos 2200 are compared as silicon designs in the same soc cohort. CPU cores: Samsung Exynos 2100 lists 8; Samsung Exynos 2200 lists 8. CPU description: Samsung Exynos 2100 lists 1 Cortex-X1 + 3 Cortex-A78 + 4 Cortex-A55; Samsung Exynos 2200 lists 1 Cortex-X2 + 3 Cortex-A710 + 4 Cortex-A510. The listed organization describes the documented configuration; it does not rank application speed.
Memory technology: Samsung Exynos 2100 lists LPDDR5; Samsung Exynos 2200 lists LPDDR5. Storage interface: Samsung Exynos 2100 lists UFS 3.1; UFS 2.1; Samsung Exynos 2200 lists UFS 3.1. Modem: Samsung Exynos 2100 lists integrated 5G; sub-6 GHz and mmWave; Samsung Exynos 2200 lists 3GPP Release 16, sub-6 GHz and mmWave, EN-DC. Process label: Samsung Exynos 2100 lists 5nm EUV; Samsung Exynos 2200 lists 4nm EUV. Reported die area: Samsung Exynos 2100 lists 128.1 mm²; Samsung Exynos 2200 lists 104.65 mm². The GPU and memory descriptions help identify the documented graphics and data interfaces. Reported geometry remains an estimate with its original qualification.
This comparison matches 12 sourced fields across 7 specification sections. 8 fields differ. 22 of 24 field values use manufacturer disclosures; remaining values retain their source evidence class. 20 field values have no publication date in the catalog. There is no matched measured workload benchmark or current price evidence in this page, so it cannot establish a purchase winner, energy-efficiency winner or total system cost.
Documented differences
| Specification / evidence | Samsung Exynos 2100silicon-die · soc | Samsung Exynos 2200silicon-die · soc |
|---|---|---|
| Maximum camera resolutionRead the original field scope, conditions and source before comparing. | 200 MPScope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-s2100 · lines 91, 104 | 200 MPScope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-s2200 · line 99 |
| ModemRead the original field scope, conditions and source before comparing. | integrated 5G; sub-6 GHz and mmWaveScope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-s2100 · line 93 | 3GPP Release 16, sub-6 GHz and mmWave, EN-DCScope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-s2200 · line 94 |
| CPU coresOrganization and listed limits do not establish workload performance. | 8Scope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-s2100 · lines 86, 97-99 | 8Scope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-s2200 · line 91 |
| CPU descriptionOrganization and listed limits do not establish workload performance. | 1 Cortex-X1 + 3 Cortex-A78 + 4 Cortex-A55Scope: SoC designEvidence: official-disclosureSource date: 2021-01-12Source: samsung-2100 · CPU paragraph — tri-cluster structure | 1 Cortex-X2 + 3 Cortex-A710 + 4 Cortex-A510Scope: SoC designEvidence: official-disclosureSource date: 2022-01-18Source: samsung-2200 · CPU paragraph — tri-cluster structure |
| CPU efficiency coresOrganization and listed limits do not establish workload performance. | 4× Cortex-A55Scope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-s2100 · line 86 | 4× Cortex-A510Scope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-s2200pdf · p.3, CPU row |
| CPU prime coreOrganization and listed limits do not establish workload performance. | 1× Cortex-X1Scope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-s2100 · lines 86, 98 | 1× Cortex-X2Scope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-s2200pdf · p.3, CPU row |
| CPU topologyOrganization and listed limits do not establish workload performance. | 1+3+4 tri-clusterScope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-s2100 · line 86 | 1+3+4 tri-clusterScope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-s2200 · line 91 |
| GPU descriptionOrganization and listed limits do not establish workload performance. | Arm Mali-G78Scope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-s2100 · lines 87, 99 | Xclipse 920Scope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-s2200pdf · p.3, GPU row |
| Process labelFoundry process names are labels, not equivalent physical dimensions. | 5nm EUVScope: SoC designEvidence: official-disclosureSource date: 2021-01-12Source: samsung-2100 · Introduction | 4nm EUVScope: SoC designEvidence: official-disclosureSource date: 2022-01-18Source: samsung-2200 · Opening statement |
| Memory technologyRead the original field scope, conditions and source before comparing. | LPDDR5Scope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-s2100 · line 103 | LPDDR5Scope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2200-table · Memory row |
| Storage interfaceRead the original field scope, conditions and source before comparing. | UFS 3.1; UFS 2.1Scope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-s2100 · line 104 | UFS 3.1Scope: SoC designEvidence: official-disclosureSource date: Not suppliedSource: specs-samsung-2200-table · Storage row |
| Reported die areaSource-reported geometry; calibration and uncertainty may be unavailable. | 128.1 mm²Scope: SoC designEvidence: third-party-reportSource date: Not suppliedSource: specs-die2100 · Die-shot Gallery, Dimensions/Area panel | 104.65 mm²Scope: SoC designEvidence: third-party-reportSource date: Not suppliedSource: specs-die2200 · Dimensions/Area panel |
Who should consider each?
Use this page to study the Samsung Exynos 2100 and Samsung Exynos 2200 designs. A device buyer should compare the specific phone, computer or accelerator SKU, cooling configuration, supported software and measured workload. A full-die specification does not describe every enabled commercial configuration.
Related records
Sources
- Samsung Sets New Standard for Flagship Mobile Processors With Exynos 2100 · Samsung · 2021-01-12
- Samsung Introduces Game Changing Exynos 2200 Processor With Xclipse GPU Powered by AMD RDNA 2 Architecture · Samsung · 2022-01-18
- Exynos 2100 (S5E9840) · Kurnal Insights · Date not supplied
- Exynos 2200 (S5E9925) · Kurnal Insights · Date not supplied
- Samsung Sets New Standard for Flagship Mobile Processors With Exynos 2100 · Samsung Global Newsroom · Date not supplied
- Samsung Introduces Game Changing Exynos 2200 Processor With Xclipse GPU Powered by AMD RDNA 2 Architecture · Samsung Global Newsroom · Date not supplied
- Exynos 2200 Product Brief · Samsung Electronics · Date not supplied
- Exynos 2200 — official structured specifications · Samsung Semiconductor · Date not supplied
A specification difference is not a measured workload result. Sources and entity scope must match before drawing performance conclusions.