VLSI KoreaSEMICONDUCTOR REFERENCE
DISCO
Find products, devices, processes and manufacturing tools with specifications and original sources.
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singulation
| Compare | Tool / family | Process application | Technology / method | Wafer / substrate | Capability |
|---|---|---|---|---|---|
DISCO DAD3220DISCO · tool model | up-to-150 mm wafer and square-workpiece dicingProcess application | unresearched | Ø6 in / 150 mm square special specificationMaximum work size | 1.5 kWSpindle power |