VLSI KoreaSEMICONDUCTOR REFERENCE
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Find products, devices, processes and manufacturing tools with specifications and original sources.
Specification query syntax
Use cores, threads, clock, boost, l2, l3, tdp, memory or year with =, >=, <=, > or <. Units: GHz, MB, W, GB. Unknown or conflicting values do not match numeric conditions.
Results
cpu
| Compare | Entity | CPU organization | Clock / peak | Cache | Process label | Die area |
|---|---|---|---|---|---|---|
AMD Ryzen 3 3100AMD · product model · 2020 | 4Cores | 3.6 GHzBase clock | 2 MBL2 cache | TSMC 7nm FinFETProcess | unresearched | |
AMD Ryzen 3 3200GAMD · product model · 2019 | 4Cores | 3.6 GHzBase clock | 2 MBL2 cacheConflicting observations | 12nm FinFETProcessConflicting observations | 209.78 mm²Die area | |
AMD Ryzen 3 3200G OEM/TrayAMD · product model · 2019 | 4Cores | 3.6 GHzBase clock | 2 MBL2 cache | 12nm FinFETProcess | unresearched | |
AMD Ryzen 3 3300XAMD · product model · 2020 | 4Cores | 3.8 GHzBase clock | 2 MBL2 cache | TSMC 7nm FinFETProcess | unresearched |