SEMICONDUCTOR REFERENCE

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Find products, devices, processes and manufacturing tools with specifications and original sources.

Specification query syntax

Use cores, threads, clock, boost, l2, l3, tdp, memory or year with =, >=, <=, > or <. Units: GHz, MB, W, GB. Unknown or conflicting values do not match numeric conditions.

26 recordsSort

cpu

Source values retain units and entity scope. Open the citation on the record for conditions. Missing fields are unresearched; conflicting observations remain visible.
Compare	Entity	CPU organization	Clock / peak	Cache	Process label	Die area
	Celeron B730Intel · product model · 2012	1Cores	1800 MHzBase clock	256 KiBL2 cache	32 nmProcess	131 mm²Die area
	Celeron B840Intel · product model · 2011	2Cores	1900 MHzBase clock	512 KiBL2 cache	32 nmProcess	131 mm²Die area
	Celeron B830Intel · product model · 2011	2Cores	1800 MHzBase clock	512 KiBL2 cache	32 nmProcess	131 mm²Die area
	Celeron B820Intel · product model · 2012	2Cores	1700 MHzBase clock	512 KiBL2 cache	32 nmProcess	131 mm²Die area
	Celeron B810Intel · product model · 2011	2Cores	1600 MHzBase clock	512 KiBL2 cache	32 nmProcess	131 mm²Die area
	Celeron B800Intel · product model · 2011	2Cores	1500 MHzBase clock	512 KiBL2 cache	32 nmProcess	131 mm²Die area
	Celeron B720Intel · product model · 2012	1Cores	1700 MHzBase clock	256 KiBL2 cache	32 nmProcess	131 mm²Die area
	Celeron B710Intel · product model · 2011	1Cores	1600 MHzBase clock	256 KiBL2 cache	32 nmProcess	131 mm²Die area
	Celeron B815Intel · product model · 2012	2Cores	1600 MHzBase clock	512 KiBL2 cache	32 nmProcess	131 mm²Die area
	Core i3-2308MIntel · product model · 2011	2Cores	2100 MHzBase clock	512 KiBL2 cache	32 nmProcess	149 mm²Die area
	Core i3-2330EIntel · product model · 2011	2Cores	2200 MHzBase clock	512 KiBL2 cache	32 nmProcess	149 mm²Die area
	Core i3-2312MIntel · product model · 2011	2Cores	2100 MHzBase clock	512 KiBL2 cache	32 nmProcess	149 mm²Die area